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Test Chip - List of Manufacturers, Suppliers, Companies and Products

Test Chip Product List

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Test chip for ultra-fine pitch wire bonding evaluation.

Test chip for ultra-fine pitch wire bonding evaluation.

Test chip for ultra-fine pitch wire bonding evaluation.

Super Fine Pitch Wire Bonding Evaluation Test Chip ■Wafer Size: 8-inch wafer ■Base Chip Size: 3.0mm × 3.0mm ■Pad Pitch: 30, 35, 40, 45, 50, 55, 60μm from the chip inner peripheral pads ■Number of Pads: 120, 136, 144, 152, 152, 160, 160 pads from the chip inner peripheral pads ■Compatible Bump Process: None ■Compatible Substrate: None ■Options: Dicing processing / Back grinding processing ■Main Applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

  • Other electronic parts
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  • Processing Contract

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Test Chip 【Multi-Type】

Test Chip 【Multi-Type】

Test Chip 【Multi-Type】

Fine pitch wire bonding, gold-plated bumps, gold stud bumps, and multi-purpose test chip ■ Wafer size: 6-inch wafer ■ Base chip size: 2.11mm × 2.11mm ■ Pad pitch: 45, 50, 60μm from the chip inner peripheral pads ■ Number of pads: 92, 92, 100 pads from the chip inner peripheral pads ■ Compatible bump processes: Gold-plated bumps (select one type from pads with 45, 50, 60μm pitch) / Gold stud bumps ■ Compatible substrates: None ■ Options: Dicing processing / Back grinding processing ■ Main applications Material development, equipment development, substrate development Process startup/development, promotional data acquisition, etc.

  • Other electronic parts
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  • Processing Contract

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Test chip for LCD driver implementation evaluation.

Test chip for LCD driver implementation evaluation.

Test chip for evaluating LCD driver implementation.

Liquid Crystal Driver Implementation Evaluation Test Chip □ Product Names ... JTEG Phase6_50/JTEG Phase6_35 JTEG Phase6_30/JTEG Phase6_25 JTEG Phase6_15S/JTEG Phase6_20 JTEG Phase6_40/JTEG Phase6_25E JTEG Phase6_60 ■ Main Applications Material development, equipment development, substrate development, process startup/development, promotional data acquisition, etc.

  • Other electronic parts
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  • Processing Contract

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Test chip 【Ultra-small chip size 0.55mm】

Test chip 【Ultra-small chip size 0.55mm】

Test chip 【Ultra-small chip size 0.55mm】

Ultra-small chip size 0.55mm□ test chip ■ Wafer size ... 6-inch wafer ■ Base chip size ... 0.55mm × 0.55mm□ ■ Pad pitch ... 110μm ■ Number of pads ... 8 pads ■ Compatible bump processes ... Gold-plated bump / Gold stud bump ■ Options ... Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation (excluding gold-plated bump products) ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

  • Other electronic parts
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  • Processing Contract

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Test chip [Large general-purpose]

Test chip [Large general-purpose]

Test chip [Large general-purpose]

General-purpose test chip with a larger chip size than JTEG Phase 0 ■ Wafer size ... 8-inch wafer ■ Base chip size ... 3.5mm × 3.5mm ■ Pad pitch ... 120μm ■ Number of pads ... 96 bumps (the inner pads do not have aluminum pads opened) ■ Compatible bump process ... gold stud bump ■ Compatible substrate ... none ■ Options ... bump mounting / dicing processing / back grinding processing ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

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  • Processing Contract

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Test chip [for ultra fine pitch WB/FC mounting evaluation]

Test chip [for ultra fine pitch WB/FC mounting evaluation]

Test chip for ultra-fine pitch WB/FC mounting evaluation.

Ultra Fine Pitch WB・FC Implementation Evaluation Test Chip ■Wafer Size ... 8-inch wafer ■Base Chip Size ... 6.0mm × 2.3mm ■Pad Pitch ... 300μm ■Number of Pads ... 16 bumps ■Compatible Bump Process ... None ■Compatible Substrate ... None ■Options ... Dicing processing / Back grinding processing ■Main Applications Material development, promotional data acquisition, etc.

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  • Processing Contract

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Test chip [Multi-type]

Test chip [Multi-type]

Test Chip 【Multi-Type】

Test chip used for wire bonding, gold-plated bumps, gold stud bumps, and multi-purpose applications. ■Wafer size: 6-inch wafer ■Base chip size: 2.13×2.1mm ■Pad pitch: 130μm ■Number of pads: 108 bumps (48 bumps on the inner circumference, 60 bumps on the outer circumference) ■Compatible bump processes: Gold-plated bumps / Gold stud bumps ■Compatible substrate: JKIT Type2 (SIDE A) ■Options: Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation (excluding gold-plated bump products) / Can be changed to gallium arsenide wafer (only for gold-plated bump products) ■Main applications: Material development, equipment development, substrate development, package development, process startup/development, promotional data acquisition, etc.

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  • Processing Contract

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Test chip with solder bumps

Test chip with solder bumps

Test chip with solder bumps

Test chip equipped with solder bumps □Product name ... JTEG Phase1E50/JTEG Phase1E28/JTEG Phase1E15 ■Main applications Material development, equipment development, substrate development, package development Process startup/development, promotional data acquisition, etc.

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  • Processing Contract

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Test chip with solder bumps

Test chip with solder bumps

Test chip with solder bumps

Test chip equipped with solder bumps (narrow pitch area type) □Product name ... JTEG Phase2E200/JTEG Phase2E175/JTEG Phase2E150 ■Main applications Material development, equipment development, substrate development, package development Process startup/development, promotional data acquisition, etc.

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  • Processing Contract

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Test chip for thermal resistance and stress measurement.

Test chip for thermal resistance and stress measurement.

Test chip for thermal resistance and stress measurement.

Thermal resistance and stress measurement test chip □Product name... JTEG Phase5/JTEG Phase5GB2 ■Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

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  • Processing Contract

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Test chip for evaluating Cu bonding with Cu bumps.

Test chip for evaluating Cu bonding with Cu bumps.

Test chip for evaluating Cu bonding with Cu bumps.

Cu bump mounted Cu bonding evaluation test chip ■Wafer size ... 8-inch wafer ■Base chip size ... 5.09mm × 5.09mm ■Pad pitch ... 150μm (staggered pads) ■Number of pads ... 841 bumps ■Compatible bump process ... Cu bump ■Compatible substrate ... None ■Options ... Bump mounting / Dicing processing / Back grinding processing ■Main applications Package development, process startup/development, promotional data acquisition, etc.

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  • Processing Contract

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Test chip with next-generation solder bumps

Test chip with next-generation solder bumps

Test chip with next-generation solder bumps.

Next-generation test chip with Low-K film used in the interlayer dielectric layer for solder bumps ■Wafer size: 8-inch wafer ■Base chip size: 5.02mm × 5.02mm ■Pad pitch: 200μm (staggered pads) ■Number of pads: 484 bumps ■Compatible bump processes: Eutectic solder / Lead-free solder ■Compatible substrate: JKIT Type 5 ■Options: Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation ■Main applications: Package development, process ramp-up / Development, promotional data acquisition, etc.

  • Other electronic parts
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  • Processing Contract

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Test chip [for ultra fine pitch WB/FC mounting evaluation]

Test chip [for ultra fine pitch WB/FC mounting evaluation]

Test chip for ultra-fine pitch WB/FC mounting evaluation.

Ultra Fine Pitch WB・FC Implementation Evaluation Test Chip □Product Name... JTEG Phase11_80/JTEG Phase11_70/JTEG Phase11_60/JTEG Phase11_50/JTEG Phase11_40 ■Main Applications Package development, process startup/development, promotional data acquisition, etc.

  • Other electronic parts
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  • Processing Contract

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